Imaging Systems Built Around Your Requirements

Tecphos delivers complete digital imaging systems defined by customer requirements—not a fixed catalog product forced into your application. We start from your goals for performance, environment, interfaces, schedule, and cost, then architect and build the system that meets them.

We provide systems engineering from concept through integration, so architecture, hardware, firmware, software, and mechanics stay aligned.

What We Deliver

We select components for systems from a wide range of vendors, then design, build, program, test, and ship:

• System definition from customer requirements, constraints, and risk
• Component selection across sensors, FPGAs, SoCs, power, connectors, and interfaces from many suppliers
• Schematic design for high-speed imaging and control electronics
• PCB layout for multi-gigabit video, power integrity, and compact or rugged packaging
• Procurement and assembly — parts sourcing and build of board-level and higher-level assemblies
• Contract manufacturing partners for specialized production operations when volume, process, or packaging needs call for them
• FPGA code for pixel processing, interfaces, and real-time imaging logic
• Microcontroller code — soft cores in FPGA fabric and discrete MCUs
• Microprocessor software — bare-metal and OS-based (including embedded Linux where required)
• Host software to interface with devices from PCs locally and remotely
• Test of design capability and functionality — bring-up, validation, and acceptance-oriented testing
• Mechanical housings optimized for ruggedness and space constraints
• Fully assembled and tested systems ready for integration into your product or deployment

From Architecture to Hardware

We help customers make the right technology choices early—partitioning work between sensor, FPGA, processor, and host; budgeting bandwidth and latency; and choosing interfaces that fit the cable plant and software ecosystem.

1. Requirements-Driven

   Systems defined by your application needs—performance, environment, interfaces, and schedule—not a one-size-fits-all platform.

2. Multi-Vendor Selection

   Components chosen from a wide vendor landscape so the design fits the product, not a single-supplier stack.

3. Assembled & Tested Delivery

   Schematics, layout, build, firmware, host software, mechanics, and full-system test in one engagement path.

Electronics, Firmware, and Software

Hardware alone is not a system. We design the electronics and write the code that makes the imaging path work end to end:

That stack connects to the sensor and interface work described under Sensors, FPGA Implementation, Video Interfaces, and Embedded SoC.

Mechanical Design and Production Path

We design mechanical housings when packaging is part of the product—balancing ruggedness, thermal needs, connectors, and tight space constraints. We support procurement, board and assembly build, and functional test so you receive a system that is assembled, exercised, and ready for the next stage of your product line.

For specialized production operations—higher volume, particular assembly processes, or packaging requirements—we partner with contract manufacturers so manufacturing can scale without losing design intent or quality control.

Engagements range from focused architecture and design packages to complete systems delivered fully assembled and tested. Reusable Tecphos IP and proven design patterns reduce schedule risk when that fits the requirements.

Typical Systems Engagements

• Requirements capture, architecture, and multi-vendor component selection
• Schematic capture and high-speed PCB layout
• Parts procurement, board assembly, and system integration
• Partnership with contract manufacturers for specialized production operations
• FPGA, MCU, MPU, and host software development
• Design capability and functional test
• Rugged or compact mechanical housing design
• Delivery of fully assembled and tested imaging systems